» In the press

2008-08-02
ECPR — Micro-cell Plating for Advanced Packaging - Affordable Accuracy at High Speeds

In a technical paper featured in Advanced Packaging Patrik Möller and Mikael Fredenberg point out the specific features of the ECPR technology that offers the unique combination of resolution, dimensional accuracy, high deposition rates and low cost per layer - giving a technology that is bridging the gap between front- and back-end metallization.

The article explains the principles of the ECPR technology, its process characteristics and how it can be used for advanced packaging applications such as integrated passives, redistribution layers, fine-pitch copper pillars and via-filling for 3D integration.

Read the paper at:
Advanced Packaging
» Press Archive

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2008-08-02
ECPR — Micro-cell Plating for Advanced Packaging - Affordable Accuracy at High Speeds

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