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2009-01-13
Replisaurus to Collaborate with IMEC on 3D Integration

Replisaurus announced today that they will collaborate with IMEC, one of Europe’s leading independent nanoelectronics research institutes, on the development of die pick-and-place and bonding processes for 3D chip integration, using S.E.T.'s Flip Chip bonder equipment.

IMEC’s 3D integration program explores 3D technology and design for applications in various domains, focusing on 3D wafer-level packaging and 3D stacked-ICs to find innovative solutions for the cost-effective use of 3D interconnects.

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2009-01-13
Replisaurus to Collaborate with IMEC on 3D Integration

2008-11-03
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2008-10-07
Replisaurus wins IC Industry 2008 Cleantech award

2008-10-06
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2008-08-23
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2008-06-05
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2006-08-22
REPLISAURUS RAISES $14.4 MILLION

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