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2005-09-21
Increased resolution capabilities of ECPR™

Recently Replisaurus has demonstrated full wafer printing of copper patterns with dimensions down to 500nm lines and 300nm spaces. The results where presented at the 31st International Conference on Micro- and Nano-Engineering 2005 (MNE2005) in Vienna. See PRESS RELEASE and visit the MNE2005 webpage.
» News Archive

2010-06-03
Replisaurus awarded Best Paper at ECTC 2010

2010-05-25
€ 9.9 million OSEO funding to support ECPR development project CUIVRE

2009-07-07
Replisaurus and Leti Partner to Drive Innovative Metallization Technology Into Final Stages

2009-01-13
Replisaurus to Collaborate with IMEC on 3D Integration

2008-11-03
Replisaurus secures 7M EUR funding from Noble Venture Finance

2008-10-07
Replisaurus wins IC Industry 2008 Cleantech award

2008-10-06
Replisaurus appoints Mike Thompson as COO

2008-08-23
Replisaurus Nominated for EuroAsia IC Industry Awards - Please vote for us!

2008-06-05
Replisaurus Acquires S.E.T. SAS to Expand Production Capacity and Product Portfolio

2006-08-22
REPLISAURUS RAISES $14.4 MILLION

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