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2010-06-03
Replisaurus awarded Best Paper at ECTC 2010

During the 60th Electronic Components and Technology Conference (ECTC) in Las Vegas, Replisaurus paper titled "Novel Multi-Layer Wiring Buildup using ElectroChemical Pattern Replication (ECPR)" was announced as the Best of Conference Paper from ECTC 2009. The authors, Mikael Fredenberg and Patrik Möller from Replisaurus and Michael Töpper from Fraunhofer IZM received the award for the paper describing a novel manufacturing sequence for top metal layers on IC chips enabled by ECPR metallization and planarized dielectric layers.

ECTC is the premier international packaging and microelectronic systems technology conference covering leading edge developments and technical innovations across the packaging spectrum.

ECTC 2009 Best of Conference announcement

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