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2010-06-03
Replisaurus awarded Best Paper at ECTC 2010

During the 60th Electronic Components and Technology Conference (ECTC) in Las Vegas, Replisaurus paper titled "Novel Multi-Layer Wiring Buildup using ElectroChemical Pattern Replication (ECPR)" was announced as the Best of Conference Paper from ECTC 2009. The authors, Mikael Fredenberg and Patrik Möller from Replisaurus and Michael Töpper from Fraunhofer IZM received the award for the paper describing a novel manufacturing sequence for top metal layers on IC chips enabled by ECPR metallization and planarized dielectric layers.

ECTC is the premier international packaging and microelectronic systems technology conference covering leading edge developments and technical innovations across the packaging spectrum.

ECTC 2009 Best of Conference announcement

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» News Archive

2006-03-02
Replisaurus receives VINNOVA R&D grant

2005-09-21
Increased resolution capabilities of ECPR™

2005-07-04
European Semiconductor Startup of 2005

2005-05-20
Replisaurus selected as one of the most promising high-tech companies in Sweden

2005-04-29
Replisaurus selected EE Times Silicon 60 company

2005-03-14
Replisaurus Technologies namned Swedish Spin-off Company of the Year 2004

2005-02-24
Replisaurus among the 5 most promising at Semiconductor Venture Fair IV

2005-02-18
Semiconductor Venture Fair IV

2004-12-10
Further venture financing

2004-12-09
EPTC 2004 Conference

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