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2010-06-03
Replisaurus awarded Best Paper at ECTC 2010

During the 60th Electronic Components and Technology Conference (ECTC) in Las Vegas, Replisaurus paper titled "Novel Multi-Layer Wiring Buildup using ElectroChemical Pattern Replication (ECPR)" was announced as the Best of Conference Paper from ECTC 2009. The authors, Mikael Fredenberg and Patrik Möller from Replisaurus and Michael Töpper from Fraunhofer IZM received the award for the paper describing a novel manufacturing sequence for top metal layers on IC chips enabled by ECPR metallization and planarized dielectric layers.

ECTC is the premier international packaging and microelectronic systems technology conference covering leading edge developments and technical innovations across the packaging spectrum.

ECTC 2009 Best of Conference announcement

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» News Archive

2010-06-03
Replisaurus awarded Best Paper at ECTC 2010

2010-05-25
€ 9.9 million OSEO funding to support ECPR development project CUIVRE

2009-07-07
Replisaurus and Leti Partner to Drive Innovative Metallization Technology Into Final Stages

2009-01-13
Replisaurus to Collaborate with IMEC on 3D Integration

2008-11-03
Replisaurus secures 7M EUR funding from Noble Venture Finance

2008-10-07
Replisaurus wins IC Industry 2008 Cleantech award

2008-10-06
Replisaurus appoints Mike Thompson as COO

2008-08-23
Replisaurus Nominated for EuroAsia IC Industry Awards - Please vote for us!

2008-06-05
Replisaurus Acquires S.E.T. SAS to Expand Production Capacity and Product Portfolio

2006-08-22
REPLISAURUS RAISES $14.4 MILLION

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