» Applications
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Typical micrometer scale applications Above IC metallization • Pad redistribution • Power metal/power distribution • Coils and low R lines for RF applications - Fine line/space enabling dense interconnects - Low resistance Cu with accurate dimension control Integrated Passive Devices (IPD) substrates • Coils • Capacitors • Resistors - High precision fine line/space metallization - Accurate CD and thickness control enabling tight tolerances - Low resistance Cu Advanced substrates • FlipChip substrates • Interposers • Chip carriers • SIP substrates - Finer line/space at lower cost on silicon, organic and ceramic substrates Microbump • Micro copper bumps for FC and stacked die - Ultra fine pitch pillar bumps - Exceptional bump height uniformity IC metallization • Top level metallization for analog and RF • Power metal for discretes and logic - Thick Cu with low resistance • Interconnect for 3/D stacked die solutions - Fine line/space for interconnect to IC-pads Other applications • MEMS metallization • Opto substrates • Chip coils |
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